Patent · US Active

Systems and methods for external frit mounted components

US8854146B2 · kind B2 · utility

1Cited by
31References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 31, 2012
Grant dateOct 7, 2014
Priority date
Expiry dateJun 17, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01D11/30
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.