Systems and methods for external frit mounted components
US8854146B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2012 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Jun 17, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D11/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.