Buffer assembly and application method thereof
US8854803B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Feb 1, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/15
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A buffer assembly includes a buffer body and an adhesive layer on the buffer body. The buffer body includes a buffer portion and a mounting portion surrounding the buffer portion. The adhesive layer includes a first adhesive portion and a second adhesive portion surrounding the first adhesive portion. The first adhesive portion and the second adhesive portion respectively correspond to the buffer portion and the mounting portion. A first cutting line is disposed between the buffer portion and the mounting portion such that the mounting portion is separable from the buffer portion along the first cutting line. A second cutting line is disposed between the first adhesive portion and the second adhesive portion such that the second adhesive portion is separable from the first adhesive portion along the second cutting line. The second cutting line superposes the first cutting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.