Modular data center
US8854809B2 · kind B2 · utility
10Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2010 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Apr 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.