Sensing device and method of attaching the same
US8857261B2 · kind B2 · utility
0Cited by
35References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Dec 1, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2634
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensing device and a method of attaching the sensing device to a target object is disclosed. The substrate of the sensing device has one or more bonding material vias that allows the bonding material used to attach the substrate to the target object to flow from one side of the substrate to the other side of the substrate. The bonding material forms rivets to secure the substrate to the target object and to secure the layers of the substrate to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.