3-dimensional curved substrate lamination

US8857490B2 · kind B2 · utility

Assignee

• Apple Inc. · US

Inventors

• Kuo-Hua Sung · San Jose, US
• Troy Edwards · Los Gatos, US
• Casey J. Feinstein · San Jose, US
• John Z. Zhong · Saratoga, US
• Steven P. Hotelling · Los Gatos, US
• Andrew Lauder · San Francisco, US

Key dates

• Filing date: May 1, 2012
• Grant date: Oct 14, 2014
• Expiry date: May 1, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/18
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.