Entrainment heat sink devices
US8857501B2 · kind B2 · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2010 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49366
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Entrainment heat sink devices and methods of forming entrainment heat sink devices are described herein. One or more method embodiments include forming an opening through a first material, forming a dimple having a trapezoidal-cross section in the first material such that the opening is located on a side wall of the trapezoidal cross-section, and attaching the first material to a second material, wherein the first material or the second material has a trench formed therein and the first material is attached to the second material such that the trench is in fluidic communication with the dimple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.