Patterning process
US8858813B2 · kind B2 · utility
1Cited by
25References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2009 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Feb 3, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A patterning process comprises (a) providing at least one substrate having at least one major surface; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound; (c) applying the patterning composition to the major surface of the substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of the major surface; and (d) etching at least a portion of the unfunctionalized region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.