Bonding an adherent to a substrate via a primer
US8859056B2 · kind B2 · utility
8Cited by
34References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2006 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Mar 2, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.