Patent · US Active

Glass wafers for semiconductor fabrication processes and methods of making same

US8859103B2 · kind B2 · utility

3Cited by

9References

7Claims

0Family size

Inventors

Joseph E. Canale · Corning, US
Jeffrey Stapleton King · Menlo Park, US
Gary Richard Trott · San Mateo, US

Key dates

Filing date	Oct 27, 2011
Grant date	Oct 14, 2014
Priority date	—
Expiry date	Nov 12, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16145
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.