Vapor deposition method, vapor deposition device and organic EL display device
US8859438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Sep 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/441
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating film (90) is formed by causing vapor deposition particles (91) to pass through a mask opening (71) of a vapor deposition mask and adhere to a substrate, the vapor deposition particles (91) being discharged from a vapor deposition source opening (61) of a vapor deposition source (60) while the substrate (10) is moved relative to the vapor deposition mask (70) in a state in which the substrate (10) and the vapor deposition mask (70) are spaced apart at a fixed interval. When a direction that is orthogonal to a normal line direction of the substrate and is orthogonal to a relative movement direction of the substrate is defined as a first direction, and the normal line direction of the substrate is defined as a second direction, a plurality of control plate columns are disposed in the first direction between the vapor deposition source opening and the vapor deposition mask, each control plate column including a plurality of control plates (80a and 80b) arranged along the second direction. With this configuration, a coating film in which blur at both edges of the coating film and variations in the blur are suppressed can be formed on a large-sized substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.