Polyamide moulding material and use thereof for production of LED housing components
US8859662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2011 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.5, where the polyamide molding material may optionally comprise customary additives (E) in addition to components (A) to (D), and where the amount thereof is in addition to the sum of components (A) to (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.