Activator for epoxy resin compositions
US8859695B2 · kind B2 · utility
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11References
13Claims
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Key dates
| Filing date | May 29, 2013 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | May 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.