Multi-light emitting diode package
US8860049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2011 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Jan 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.