Semiconductor interconnect
US8860147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2007 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Sep 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment relates to an integrated circuit that includes at least one semiconductor device. The integrated circuit includes a first contact associated with a first terminal of the semiconductor device. The first contact spans a dielectric layer and couples the first terminal to an interconnect line that communicates signals horizontally on the integrated circuit, where the interconnect line has a first composition. The integrated circuit further includes a second contact associated with a second terminal of the semiconductor device. The second contact spans the dielectric layer and couples the second terminal to a landing pad to which a via is coupled, where the landing pad has a second composition that differs from the first composition. Other circuits and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.