Chip assembly and chip assembling method
US8860219B2 · kind B2 · utility
1Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Jul 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.