Non-destructive tilt data measurement to detect defective bumps
US8860456B2 · kind B2 · utility
1Cited by
22References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2011 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Sep 7, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure includes techniques and apparatus for making non-contact differential measurements of various dimensions of electronic components surface mounted on circuit boards. Tilt data relating to the electronic components is derived from the differential measurements to provide an indication of the integrity of the electrical connection between the electronic components to the circuit board. The techniques and apparatus of the present disclosure make it possible to accomplish non-destructive inspection of the connection without individually inspecting each bump-terminal connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.