System using multi-layer wire structure for high efficiency wireless communication
US8860545B2 · kind B2 · utility
94Cited by
24References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Oct 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49195
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.