Method for fabricating a multi-layer capacitor and a multi-layer capacitor
US8861184B2 · kind B2 · utility
77Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Sep 11, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1044
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The method comprises fabricating a layer stack on a substrate, the layer stack comprising at least two electrically conducting layers and at least one electrically insulating layer arranged between the two electrically conducting layers, and displacing a first portion of the layer stack away from its original position, the first portion comprising an edge portion of the layer stack, and bending the first portion back towards a second portion of the layer stack. The bending may comprise a rolling-up of the first portion of the layer stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.