Patent · US Active

Integrated heat spreader and method of fabrication

US8863383B2 · kind B2 · utility

0Cited by
5References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 20, 2012
Grant dateOct 21, 2014
Priority date
Expiry dateJun 18, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/0207
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.