Metal-infiltrated titanium—silicon-carbide and titanium—aluminum-carbide bodies
US8863816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2009 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Oct 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24992
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Densified composites of a metal such as copper or aluminum with a titanium-silicon-carbide or titanium-aluminum-carbide ceramic material are prepared by forming the ceramic material into a body, and infiltrating the body with the molten metal. The metal is able to rapidly penetrate into void spaces, between grain boundaries and even into the crystal structure of the ceramic grains to form a composite. The starting ceramic material may be previously densified, in which case various types of gradient structures can be produced easily. The process can be operated at low pressures, and so the hot pressing methods that normally must be used to densify these ceramic materials can be avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.