Method of fabricating a microcircuit device
US8864040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2011 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jul 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.