Patent · US Active

Thermal nanoimprint lithography mould, process for producing it, and thermal nanoimprint process employing it

US8864489B2 · kind B2 · utility

1Cited by

2References

37Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Stefan Landis · Tullins, FR
Sergio Nicoletti · Le Pont-de-Claix, FR

Key dates

Filing date	Sep 13, 2010
Grant date	Oct 21, 2014
Priority date	—
Expiry date	Jan 23, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB82Y40/00
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A heating mould for thermal nanoimprint lithography, a process of producing the heating mould, and a process for producing a nanostructured substrate which include the heating mould. The heating mould includes the heating mould. The heating mould includes a substrate having a first principal surface and a second principal surface, and a through-cavity extending from a first orifice in the first principal surface up to a second orifice in the second principal surface. The mould also includes a heating layer, an electrically and thermally insulating layer which covers the heating layer and, at least partially, imprint patterns, and leads for supplying an electric current to the heating layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.