Multi-conduit manifolds, systems, and methods for applying reduced pressure to a subcutaneous tissue site
US8864728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2009 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Feb 5, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The illustrative embodiments described herein are directed to systems, methods, and apparatuses for applying a reduced pressure to a subcutaneous tissue site. In one instance, a manifold for applying reduced pressure to a subcutaneous tissue site includes a plurality of first conduits, each of the plurality of first conduits having a wall with at least one first aperture and at least one second aperture. At least one of the plurality of first conduits is operable to deliver reduced pressure to the subcutaneous tissue site. The plurality of first conduits is coupled in a spaced arrangement that forms an interior space. The manifold further includes a second conduit comprising the interior space and formed by a portion of each wall of the plurality of first conduits. The second conduit is in fluid communication with the plurality of first conduits via the at least one second aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.