Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8865489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Aug 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.