Semiconductor device and method for manufacturing a semiconductor device
US8865526B2 · kind B2 · utility
0Cited by
17References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 10, 2013 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Apr 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.