Polyamide resin composition having improved physical properties including thin-wall moldability
US8865807B2 · kind B2 · utility
3Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition comprises (A) about 10 to about 70% by weight of a crystalline polyamide resin, (B) about 10 to about 70% by weight of an amorphous polyamide resin, (C) about 5 to about 30% by weight of an inorganic filler, and (D) about 10 to about 50% by weight of a white pigment. The polyamide resin composition can have good thin-wall moldability, light reflectance, yellowing resistance, impact strength and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.