Patent · US Active

Polyamide moulding composition and use thereof

US8865821B2 · kind B2 · utility

5Cited by
0References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 30, 2013
Grant dateOct 21, 2014
Priority date—
Expiry dateApr 30, 2033

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2207/04
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A thermoplastic molding composition, in particular a polyamide molding composition, consisting of, by weight:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.