Sealable material and method of forming a dielectric weld
US8865825B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
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Key dates
| Filing date | Feb 11, 2013 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Feb 11, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A dielectric weldable material includes a blend of at least two components including an inert polymer and an elastomeric polar polymer. A method of forming a bond includes providing a substrate having a first end and a second end, wherein the substrate includes a blend of at least two components including an inert polymer and an elastomeric polar polymer. The method further includes bonding the first end and second end of the substrate with high frequency electromagnetic energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.