Printed wiring board and method for manufacturing the same
US8866027B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 16, 2008 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.