LED package module structure
US8866182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2012 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Oct 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A light emitting diode package module structure comprises a LED module received in a reflection cup, a light transmitting color conversion member disposed on an annular surface of the reflection cup, a stationary package sleeved on the reflection cup in such a manner that the press portion of the stationary package is pressed against the light transmitting color conversion member, and the stop portions of the positioning legs of the stationary package are positioned against the bottom of the reflection cup. In this way, the light transmitting color conversion member is fixed to the reflection cup by the stationary package without the use of adhesive agents, which consequently simplifies the packaging procedure and reduces the package cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.