Devices and methods for solder flow control in three-dimensional microstructures
US8866300B1 · kind B1 · utility
12Cited by
129References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2012 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jun 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.