Light emitting unit, manufacturing method thereof and touch panel having the same
US8866765B2 · kind B2 · utility
2Cited by
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8Claims
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Key dates
| Filing date | Oct 9, 2011 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jun 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.