Multilayer ceramic electronic component and fabricating method thereof
US8867188B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2011 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jul 1, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There are provided a multilayer ceramic electronic component and a fabricating method thereof. The multilayer ceramic electronic component includes: a multilayer ceramic body including a first ceramic powder and having a plurality of ceramic sheets stacked therein, each ceramic sheet having a thickness of 1 μm or less; internal electrode patterns formed on the plurality of ceramic sheets; and dielectric patterns formed on the ceramic sheets to enclose the internal electrode patterns, the dielectric patterns including a second ceramic powder having a particle size smaller than that of the first ceramic powder and each having a thickness equal to or thinner than that of each of the internal electrode patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.