Pressure sensor mounting structure
US8869623B2 · kind B2 · utility
2Cited by
6References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2011 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Jan 24, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0654
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor pressure sensor includes: a case; a pressure inlet port through which a measurement target fluid is introduced into the case; an atmosphere inlet port through which atmosphere is introduced; and a sensor chip configured to measure the pressure of the fluid with respect to atmospheric pressure. The pressure inlet port and the atmosphere inlet port are disposed on the same surface side of the case. The pressure inlet port is communicated with the inside of the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.