In-situ monitoring device and method to determine accumulated printed wiring board vibration stress fatigue
US8869624B2 · kind B2 · utility
4Cited by
39References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2010 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Mar 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A monitoring system includes a calibrated micro-electro-mechanical structure (MEMS) matrix in communication with a controller. The MEMS matrix includes MEMS elements of various sizes which create a continuum of vibration-stress-resistant elements. The MEMS elements will flex in response to flexing of a printed circuit board due to mechanical vibration until failure occurs. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.