Microchannel cooler for light emitting diode light fixtures
US8870418B2 · kind B2 · utility
1Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Nov 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lighting module has an array of light emitters, a heat sink having a first surface, the array of light emitters being mounted to the first surface, a microchannel cooler arranged on a second surface of the heat sink on an opposite side of the heat sink from the first surface, the microchannel cooler arranged to transport a liquid through a channel on the second surface of the heat sink, and a cooling unit thermally coupled to a microchannel cooler and arranged to remove heat from the liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.