Encapsulated metal microtip microplasma device and array fabrication methods
US8870618B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Aug 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2245/15
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Methods of the invention can form microtip microplasma devices having the first and second metal microtips and metal oxide in a monolithic, unitary structure. Methods can form arrays that can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.