Patent · US Active

Deployment instrument for closure device for percutaneously sealing punctures

US8870917B2 · kind B2 · utility

39Cited by
19References
30Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 19, 2011
Grant dateOct 28, 2014
Priority date
Expiry dateApr 12, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49954
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A deployment instrument for deploying a closure device for sealing a percutaneous puncture in a wall of a body passageway, the deployment instrument including a carrier assembly, wherein the carrier assembly is configured to hold the closure device in a pre-deployment state, and a tensioner assembly, wherein the filament is fixedly attached to the tensioner assembly, wherein the deployment instrument is configured to increase the tension in the filament upon linear movement of the deployment instrument away from the wall of the body passageway when the closure device is anchored to the wall via the anchor such that the tension is gradually increased as the deployment instrument is moved between a first linear distance and a second linear distance greater than the first linear distance from the wall of the body passageway.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.