Positive resist composition and patterning process
US8871427B2 · kind B2 · utility
1Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Jun 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/115
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is disclosed a positive resist composition comprising (A) a resin having repeating units shown by the following general formulae (1) and (2) as repeating units that contain acid labile groups and being capable of increasing its alkaline solubility by an acid, (B) a photoacid generator, (C) a compound shown by the following general formula (3), and (D) a solvent. There can be a positive resist composition having high resolution, and at the same time giving an excellent pattern profile; and a patterning process in which an immersion lithography is carried out using a formed top coat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.