Method for manufacturing LED
US8871535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Apr 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.