Patent · US Active

Method to form solder deposits on substrates

US8871631B2 · kind B2 · utility

7Cited by

1References

13Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Sven Lamprecht · Berlin, DE
Kai-Jens Matejat · Berlin, DE
Ingo Ewert · Berlin, DE
Stephen Kenny · Orangeville, CA

Key dates

Filing date	Jun 23, 2011
Grant date	Oct 28, 2014
Priority date	—
Expiry date	Nov 23, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.