Patent · US Active

Hotmelt adhesive comprising radiation-crosslinkable poly(meth)acrylate and oligo(meth)acrylate with nonacrylic C-C double bonds

US8871827B2 · kind B2 · utility

1Cited by

5References

19Claims

0Family size

Assignee

BASF SE

Inventors

Ulrike Licht · Mannheim, DE
Dirk Wulff · Schifferstadt, DE
Thomas Christ · Auburn Hills, US
Ulrich Filges · Schifferstadt, DE

Key dates

Filing date	Jun 4, 2012
Grant date	Oct 28, 2014
Priority date	—
Expiry date	Jul 20, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2826
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl(meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C C double bonds and has a K value of less than or equal to 20. The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.