Laser cutting process for forming stents
US8872062B2 · kind B2 · utility
13Cited by
68References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2010 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Jan 1, 2032 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2240/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for improving the cutting efficiency and cut profile of stent strut is provided. A means for altering the energy distribution of a laser beam is provided, along with various ways of controlling a laser to provide for improved strut configurations are provided. A method for improved cutting speeds using a combination of laser sources is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.