Laser machining apparatus and method for the manufacture of a rotationally symmetrical tool
US8872065B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2011 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Sep 17, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for the manufacture of a tool from a blank, such as, a rotational tool which rotates about a longitudinal axis (L) which includes at least one cutting edge and a chip groove. Preferably, the rotational tool is in its operating area in a cross-section thereof radially symmetrical with respect to it's longitudinal axis (L) and manufactured from a cylindrical blank by laser ablation using a laser machining apparatus with a laser scanner with a predetermined pulse area. The laser beam impulses are directed via a positioning arrangement within the pulse area onto a plurality of impact locations disposed along a predetermined pulse path (B). This pulse area is moved, like a tool, along the surface of the blank to form the chip groove and the cutting edge by sublimation of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.