Light emitting device package
US8872195B2 · kind B2 · utility
3Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2014 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | May 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.