Push-pull magnetoresistive sensor bridges and mass fabrication method
US8872292B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 2, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Mar 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48464
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multi-chip push-pull magnetoresistive bridge sensor utilizing magnetic tunnel junctions is disclosed. The magnetoresistive bridge sensor is composed of a two or more magnetic tunnel junction sensor chips placed in a semiconductor package. For each sensing axis parallel to the surface of the semiconductor package, the sensor chips are aligned with their reference directions in opposition to each other. The sensor chips are then interconnected as a push-pull half-bridge or Wheatstone bridge using wire bonding. The chips are wire-bonded to any of various standard semiconductor lead frames and packaged in inexpensive standard semiconductor packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.