Semiconductor device
US8872327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Sep 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical conductors, a first power terminal, a second power terminal, a signal terminal, and an insulator which covers the components. The insulator includes a flat bottom surface in which the first and second electrical conductors are exposed, a ceiling surface, a first end surface, and a second end surface. The power terminals and the signal terminal extend outwardly from the first and second end surfaces, and the ceiling surface, respectively. The first end surface, the ceiling surface, and the second end surface are formed with a parting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.