Patent · US Active

System and method for integrated waveguide packaging

US8872333B2 · kind B2 · utility

6Cited by

23References

19Claims

0Family size

Assignee

VIASAT, INC. · US

Inventors

Noel Lopez · Chandler, US
Michael R. Lyons · Gilbert, US
Dave Laidig · Mesa, US
Kenneth V. Buer · Gilbert, US

Key dates

Filing date	Dec 5, 2011
Grant date	Oct 28, 2014
Priority date	—
Expiry date	May 7, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10189
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.