Anisotropic conductive film composition and semiconductor device bonded by the same
US8872357B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Nov 7, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Nov 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An anisotropic conductive film composition for bonding a semiconductor device, the composition including: a binder system including a urethane resin having a glass transition temperature of about 100° C. or higher, a radical polymerizable compound, an organic peroxide, and conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.