Electronic device housing having a low-density component and a high-stiffness component
US8873226B1 · kind B1 · utility
16Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Nov 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device housing including a relatively thin and stiff support plate and including a relatively thick and low-density edge frame is described. The support plate may be composed of a composite material, such as carbon-fiber reinforced polymer or aluminum metal matrix composite, and the edge frame may be composed of a foam material, such as closed-cell aluminum foam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.